| # | 公司 | 市场 | 市值 | 占中国 | 今日涨跌 | 近30天 | 收盘价 | 所处环节 |
|---|---|---|---|---|---|---|---|---|
| 1 | SH | $133.7B | 9.6% | -0.49% | 45.00 CNY | 服务器与 ODM | ||
| 2 | SZ | $97.6B | 7.0% | -4.99% | 553.00 CNY | 光模块与光器件 | ||
| 3 | SH | $82.9B | 5.9% | -3.61% | 880.00 CNY | GPU / AI 芯片 | ||
| 4 | SH | $59.2B | 4.2% | -8.44% | 170.20 CNY | GPU / AI 芯片 | ||
| 5 | SZ | $52.9B | 3.8% | -5.14% | 45.60 CNY | 铜连接与线缆 | ||
| 6 | SZ | $52.2B | 3.7% | -3.73% | 478.74 CNY | 半导体设备 | ||
| 7 | HK | $46.9B | 3.4% | -4.40% | 42.98 HKD | 晶圆代工与封装 | ||
| 8 | SZ | $40.9B | 2.9% | -14.19% | 196.00 CNY | 光模块与光器件 | ||
| 9 | HK | $33.5B | 2.4% | -7.41% | 20.50 HKD | 服务器与 ODM | ||
| 10 | SH | $31.7B | 2.3% | -7.56% | 87.00 CNY | PCB 与覆铜板 | ||
| 11 | SH | $30.7B | 2.2% | -5.86% | 213.69 CNY | 半导体设备 | ||
| 12 | SH | $28.9B | 2.1% | -5.09% | 158.30 CNY | GPU / AI 芯片 | ||
| 13 | SH | $27.2B | 1.9% | -6.59% | 257.80 CNY | 存储 / HBM | ||
| 14 | SZ | $25.2B | 1.8% | -7.19% | 87.34 CNY | PCB 与覆铜板 | ||
| 15 | SZ | $25.1B | 1.8% | -8.58% | 86.06 CNY | PCB 与覆铜板 | ||
| 16 | SZ | $24.2B | 1.7% | -8.42% | 148.00 CNY | 光模块与光器件 | ||
| 17 | SZ | $23.8B | 1.7% | -8.20% | 233.00 CNY | PCB 与覆铜板 | ||
| 18 | SZ | $20.5B | 1.5% | -13.31% | 139.04 CNY | PCB 与覆铜板 | ||
| 19 | SZ | $19.6B | 1.4% | -1.55% | 27.36 CNY | 网络设备与交换 | ||
| 20 | SZ | $19.3B | 1.4% | -9.17% | 55.60 CNY | PCB 与覆铜板 | ||
| 21 | SH | $17.8B | 1.3% | -7.37% | 407.73 CNY | 半导体设备 | ||
| 22 | SZ | $16.4B | 1.2% | -5.95% | 168.28 CNY | 半导体设备 | ||
| 23 | SH | $15.6B | 1.1% | -5.40% | 71.29 CNY | 服务器与 ODM | ||
| 24 | HK | $14.9B | 1.1% | -6.04% | 60.70 HKD | 晶圆代工与封装 | ||
| 25 | SZ | $14.6B | 1.0% | -4.22% | 212.17 CNY | 存储 / HBM | ||
| 26 | SH | $14.3B | 1.0% | -0.57% | 63.00 CNY | 服务器与 ODM | ||
| 27 | SH | $13.1B | 0.9% | -5.53% | 49.00 CNY | 晶圆代工与封装 | ||
| 28 | SH | $12.8B | 0.9% | -7.19% | 688.99 CNY | 光模块与光器件 | ||
| 29 | SZ | $12.7B | 0.9% | -8.67% | 102.60 CNY | 光模块与光器件 | ||
| 30 | SH | $12.5B | 0.9% | -7.62% | 163.45 CNY | 半导体设备 | ||
| 31 | SZ | $12.5B | 0.9% | -6.24% | 50.96 CNY | IDC 与算力服务 | ||
| 32 | SH | $12.0B | 0.9% | -8.89% | 165.63 CNY | 半导体设备 | ||
| 33 | SZ | $11.9B | 0.9% | -3.56% | 54.18 CNY | 服务器与 ODM | ||
| 34 | SZ | $10.6B | 0.8% | -6.44% | 63.80 CNY | 网络设备与交换 | ||
| 35 | SH | $10.5B | 0.8% | -5.49% | 65.43 CNY | PCB 与覆铜板 | ||
| 36 | SH | $10.1B | 0.7% | -11.95% | 163.68 CNY | 网络设备与交换 | ||
| 37 | SZ | $10.0B | 0.7% | -2.64% | 209.71 CNY | 存储 / HBM | ||
| 38 | SZ | $9.9B | 0.7% | -4.12% | 23.03 CNY | 网络设备与交换 | ||
| 39 | SZ | $9.7B | 0.7% | -3.67% | 40.72 CNY | 晶圆代工与封装 | ||
| 40 | SZ | $9.4B | 0.7% | -7.65% | 62.15 CNY | 光模块与光器件 | ||
| 41 | SH | $9.3B | 0.7% | -5.31% | 130.77 CNY | 存储 / HBM | ||
| 42 | SZ | $8.5B | 0.6% | -1.83% | 109.61 CNY | 存储 / HBM | ||
| 43 | SH | $8.4B | 0.6% | -8.63% | 65.33 CNY | PCB 与覆铜板 | ||
| 44 | SH | $8.2B | 0.6% | -6.56% | 24.35 CNY | 晶圆代工与封装 | ||
| 45 | SH | $7.7B | 0.6% | -9.43% | 98.19 CNY | EDA 与 IP | ||
| 46 | SZ | $7.7B | 0.6% | -7.70% | 206.56 CNY | 光模块与光器件 | ||
| 47 | SZ | $7.5B | 0.5% | -1.12% | 15.00 CNY | 晶圆代工与封装 | ||
| 48 | SZ | $7.4B | 0.5% | -5.55% | 28.91 CNY | PCB 与覆铜板 | ||
| 49 | SH | $7.3B | 0.5% | -4.16% | 125.20 CNY | 光模块与光器件 | ||
| 50 | SZ | $7.2B | 0.5% | -7.74% | 37.80 CNY | 液冷与散热 | ||
| 51 | SZ | $7.1B | 0.5% | -11.80% | 86.17 CNY | EDA 与 IP | ||
| 52 | SZ | $6.8B | 0.5% | -5.90% | 77.72 CNY | 电源 | ||
| 53 | SH | $6.8B | 0.5% | -7.67% | 190.76 CNY | PCB 与覆铜板 | ||
| 54 | SZ | $6.6B | 0.5% | -6.54% | 94.03 CNY | 存储 / HBM | ||
| 55 | SH | $6.3B | 0.4% | -6.25% | 92.53 CNY | 光模块与光器件 | ||
| 56 | SH | $6.1B | 0.4% | -9.15% | 201.89 CNY | 半导体设备 | ||
| 57 | SH | $5.7B | 0.4% | -12.71% | 187.00 CNY | 半导体设备 | ||
| 58 | SZ | $5.6B | 0.4% | -9.87% | 126.08 CNY | 光模块与光器件 | ||
| 59 | SZ | $5.4B | 0.4% | -7.29% | 80.30 CNY | 光模块与光器件 | ||
| 60 | SH | $5.3B | 0.4% | -6.13% | 26.18 CNY | 服务器与 ODM | ||
| 61 | SH | $4.9B | 0.4% | -8.54% | 82.07 CNY | GPU / AI 芯片 | ||
| 62 | SH | $4.6B | 0.3% | -8.64% | 100.71 CNY | 半导体设备 | ||
| 63 | US | $4.4B | 0.3% | -5.35% | 21.92 USD | IDC 与算力服务 | ||
| 64 | SZ | $4.3B | 0.3% | -8.25% | 103.68 CNY | 半导体设备 | ||
| 65 | SH | $4.1B | 0.3% | -9.31% | 28.73 CNY | 半导体设备 | ||
| 66 | SZ | $4.0B | 0.3% | -14.63% | 117.85 CNY | 光模块与光器件 | ||
| 67 | SZ | $3.8B | 0.3% | -3.73% | 20.13 CNY | 服务器与 ODM | ||
| 68 | SZ | $3.5B | 0.3% | -4.17% | 45.00 CNY | GPU / AI 芯片 | ||
| 69 | SH | $3.5B | 0.2% | -0.05% | 147.29 CNY | PCB 与覆铜板 | ||
| 70 | SH | $3.5B | 0.2% | -8.47% | 31.97 CNY | PCB 与覆铜板 | ||
| 71 | SH | $3.4B | 0.2% | -8.24% | 130.30 CNY | 光模块与光器件 | ||
| 72 | SZ | $3.3B | 0.2% | -7.45% | 59.15 CNY | 液冷与散热 | ||
| 73 | SZ | $3.1B | 0.2% | -10.14% | 157.44 CNY | 光模块与光器件 | ||
| 74 | SZ | $3.1B | 0.2% | -4.53% | 68.36 CNY | 液冷与散热 | ||
| 75 | SZ | $3.0B | 0.2% | -1.44% | 19.82 CNY | 服务器与 ODM | ||
| 76 | SZ | $2.9B | 0.2% | -3.54% | 13.88 CNY | 铜连接与线缆 | ||
| 77 | SZ | $2.9B | 0.2% | -2.99% | 15.55 CNY | PCB 与覆铜板 | ||
| 78 | SZ | $2.7B | 0.2% | -5.29% | 93.10 CNY | PCB 与覆铜板 | ||
| 79 | SH | $2.6B | 0.2% | -10.30% | 97.58 CNY | 光模块与光器件 | ||
| 80 | SZ | $2.6B | 0.2% | -4.52% | 22.80 CNY | 电源 | ||
| 81 | SZ | $2.5B | 0.2% | -5.01% | 9.11 CNY | IDC 与算力服务 | ||
| 82 | SZ | $2.5B | 0.2% | -6.61% | 21.62 CNY | 网络设备与交换 | ||
| 83 | SH | $2.4B | 0.2% | -4.82% | 18.95 CNY | IDC 与算力服务 | ||
| 84 | SH | $2.4B | 0.2% | -13.20% | 102.51 CNY | 光模块与光器件 | ||
| 85 | SH | $2.4B | 0.2% | -7.27% | 99.55 CNY | 存储 / HBM | ||
| 86 | SH | $2.4B | 0.2% | -8.66% | 34.81 CNY | 晶圆代工与封装 | ||
| 87 | SZ | $2.4B | 0.2% | -5.75% | 26.87 CNY | 液冷与散热 | ||
| 88 | SH | $2.3B | 0.2% | -7.47% | 29.50 CNY | EDA 与 IP | ||
| 89 | SH | $2.3B | 0.2% | -9.79% | 43.10 CNY | GPU / AI 芯片 | ||
| 90 | SZ | $2.3B | 0.2% | -7.13% | 15.64 CNY | IDC 与算力服务 | ||
| 91 | SZ | $2.2B | 0.2% | -8.55% | 96.48 CNY | 电源 | ||
| 92 | SZ | $2.2B | 0.2% | -0.26% | 34.60 CNY | 铜连接与线缆 | ||
| 93 | SH | $2.1B | 0.2% | -7.82% | 100.62 CNY | 铜连接与线缆 | ||
| 94 | SZ | $2.0B | 0.1% | -5.62% | 37.80 CNY | 服务器与 ODM | ||
| 95 | SZ | $2.0B | 0.1% | -8.25% | 77.72 CNY | 液冷与散热 | ||
| 96 | SZ | $1.9B | 0.1% | -6.46% | 22.73 CNY | 电源 | ||
| 97 | SH | $1.7B | 0.1% | -6.41% | 24.83 CNY | IDC 与算力服务 | ||
| 98 | SH | $1.7B | 0.1% | -9.41% | 35.52 CNY | 半导体设备 | ||
| 99 | SZ | $1.6B | 0.1% | -6.36% | 52.27 CNY | EDA 与 IP | ||
| 100 | SZ | $1.5B | 0.1% | +4.05% | 17.20 CNY | PCB 与覆铜板 | ||
| 101 | SH | $1.5B | 0.1% | -8.67% | 33.70 CNY | 铜连接与线缆 | ||
| 102 | SZ | $1.4B | 0.1% | -1.96% | 27.55 CNY | 铜连接与线缆 | ||
| 103 | SZ | $1.3B | 0.1% | -3.55% | 3.80 CNY | 电源 | ||
| 104 | SZ | $1.3B | 0.1% | -6.60% | 74.18 CNY | 液冷与散热 | ||
| 105 | SZ | $1.1B | 0.1% | -5.10% | 15.06 CNY | IDC 与算力服务 | ||
| 106 | SZ | $1.1B | 0.1% | -5.78% | 38.64 CNY | 铜连接与线缆 | ||
| 107 | SZ | $1.1B | 0.1% | -7.37% | 23.51 CNY | 液冷与散热 | ||
| 108 | SH | $982M | 0.1% | -4.83% | 17.13 CNY | 半导体设备 | ||
| 109 | US | $918M | 0.1% | -4.45% | 3.22 USD | IDC 与算力服务 | ||
| 110 | SZ | $916M | 0.1% | -4.79% | 8.94 CNY | 铜连接与线缆 | ||
| 111 | SZ | $882M | 0.1% | -2.74% | 41.83 CNY | IDC 与算力服务 | ||
| 112 | SH | $865M | 0.1% | -7.06% | 18.04 CNY | 网络设备与交换 | ||
| 113 | SZ | $801M | 0.1% | -6.33% | 55.17 CNY | 网络设备与交换 | ||
| 114 | SZ | $721M | 0.1% | -3.85% | 10.50 CNY | 液冷与散热 | ||
| 115 | SZ | $662M | 0.0% | -5.13% | 18.69 CNY | 光模块与光器件 | ||
| 116 | SH | $620M | 0.0% | -4.97% | 6.88 CNY | IDC 与算力服务 | ||
| 117 | SH | $273M | 0.0% | -7.51% | 38.06 CNY | IDC 与算力服务 |
中国共有 117 家公司进入 AI 算力产业链市值榜,合计市值 1.40 万亿美元($1.40T),占全链 6.7%。
市值居首的是 工业富联($133.7B,占该国 9.6%),前三集中度 22.5%。 该国公司在产业链中主要分布于:光模块与光器件(17.6%)、服务器与 ODM(16.0%)、PCB 与覆铜板(13.8%)。
括号内「占中国」为该公司市值在该国 AI 算力公司合计市值中的占比; 「所处环节」链接到对应环节榜,可横向比较该国在各细分赛道的布局。