| # | 公司 | 市场 | 市值 | 占中国台湾 | 今日涨跌 | 近30天 | 收盘价 | 所处环节 |
|---|---|---|---|---|---|---|---|---|
| 1 | TW | $1.89T | 63.4% | -1.86% | 2,370.00 TWD | 晶圆代工与封装 | ||
| 2 | TW | $193.0B | 6.5% | -3.21% | 3,915.00 TWD | GPU / AI 芯片 | ||
| 3 | TW | $106.5B | 3.6% | -9.80% | 1,335.00 TWD | 电源 | ||
| 4 | TW | $105.8B | 3.6% | -1.01% | 245.50 TWD | 服务器与 ODM | ||
| 5 | TW | $92.1B | 3.1% | -2.20% | 668.00 TWD | 晶圆代工与封装 | ||
| 6 | TW | $51.5B | 1.7% | -6.69% | 4,675.00 TWD | PCB 与覆铜板 | ||
| 7 | TW | $49.9B | 1.7% | -4.90% | 989.00 TWD | PCB 与覆铜板 | ||
| 8 | TW | $43.1B | 1.4% | -3.46% | 111.50 TWD | 晶圆代工与封装 | ||
| 9 | TW | $40.1B | 1.3% | +0.00% | 318.00 TWD | 服务器与 ODM | ||
| 10 | TW | $37.3B | 1.3% | -0.32% | 3,095.00 TWD | 液冷与散热 | ||
| 11 | TW | $31.4B | 1.1% | -0.07% | 7,635.00 TWD | GPU / AI 芯片 | ||
| 12 | TW | $31.1B | 1.0% | -3.98% | 1,810.00 TWD | 服务器与 ODM | ||
| 13 | TW | $28.6B | 1.0% | -1.41% | 6,315.00 TWD | 液冷与散热 | ||
| 14 | TW | $28.3B | 0.9% | -2.33% | 9,650.00 TWD | 服务器与 ODM | ||
| 15 | TW | $23.6B | 0.8% | -4.80% | 1,190.00 TWD | PCB 与覆铜板 | ||
| 16 | TW | $20.7B | 0.7% | -4.63% | 906.00 TWD | 服务器与 ODM | ||
| 17 | TW | $19.3B | 0.6% | -2.65% | 183.50 TWD | 服务器与 ODM | ||
| 18 | TW | $17.1B | 0.6% | -4.56% | 240.50 TWD | 电源 | ||
| 19 | TW | $16.7B | 0.6% | -8.52% | 1,020.00 TWD | PCB 与覆铜板 | ||
| 20 | TW | $15.1B | 0.5% | -2.82% | 932.00 TWD | PCB 与覆铜板 | ||
| 21 | TW | $11.2B | 0.4% | -8.99% | 1,265.00 TWD | PCB 与覆铜板 | ||
| 22 | TW | $10.0B | 0.3% | -5.94% | 253.50 TWD | 晶圆代工与封装 | ||
| 23 | TW | $9.6B | 0.3% | -4.17% | 66.60 TWD | 晶圆代工与封装 | ||
| 24 | TW | $9.1B | 0.3% | -6.93% | 3,425.00 TWD | GPU / AI 芯片 | ||
| 25 | TW | $8.4B | 0.3% | -1.91% | 102.50 TWD | 服务器与 ODM | ||
| 26 | TW | $8.3B | 0.3% | -7.99% | 144.00 TWD | 晶圆代工与封装 | ||
| 27 | TW | $8.3B | 0.3% | -4.48% | 512.00 TWD | PCB 与覆铜板 | ||
| 28 | TW | $7.7B | 0.3% | -7.79% | 687.00 TWD | PCB 与覆铜板 | ||
| 29 | TW | $7.4B | 0.2% | -7.96% | 2,370.00 TWD | 光模块与光器件 | ||
| 30 | TW | $6.9B | 0.2% | -2.04% | 336.00 TWD | 服务器与 ODM | ||
| 31 | TW | $6.6B | 0.2% | -3.09% | 59.50 TWD | 服务器与 ODM | ||
| 32 | TW | $6.4B | 0.2% | -2.11% | 1,860.00 TWD | 铜连接与线缆 | ||
| 33 | TW | $6.0B | 0.2% | -5.36% | 256.00 TWD | 晶圆代工与封装 | ||
| 34 | TW | $4.8B | 0.2% | -3.96% | 35.20 TWD | 服务器与 ODM | ||
| 35 | TW | $4.5B | 0.2% | -3.45% | 196.00 TWD | 晶圆代工与封装 | ||
| 36 | TW | $4.1B | 0.1% | -7.12% | 1,435.00 TWD | 液冷与散热 | ||
| 37 | TW | $4.1B | 0.1% | -1.56% | 157.50 TWD | 服务器与 ODM | ||
| 38 | TW | $3.8B | 0.1% | -9.22% | 1,330.00 TWD | 液冷与散热 | ||
| 39 | TW | $3.4B | 0.1% | -3.40% | 76.80 TWD | 服务器与 ODM | ||
| 40 | HK | $3.1B | 0.1% | -4.42% | 3.35 HKD | 铜连接与线缆 | ||
| 41 | TW | $1.3B | 0.0% | -9.72% | 144.00 TWD | 液冷与散热 | ||
| 42 | TW | $1.0B | 0.0% | -2.62% | 39.00 TWD | 电源 | ||
| 43 | TW | $829M | 0.0% | -2.32% | 67.30 TWD | 电源 | ||
| 44 | TW | $434M | 0.0% | -8.38% | 180.50 TWD | 光模块与光器件 | ||
| 45 | TW | $165M | 0.0% | -3.17% | 61.00 TWD | 液冷与散热 |
中国台湾共有 45 家公司进入 AI 算力产业链市值榜,合计市值 2.98 万亿美元($2.98T),占全链 14.3%。
市值居首的是 台积电($1.89T,占该国 63.4%),前三集中度 73.5%。 该国公司在产业链中主要分布于:晶圆代工与封装(69.3%)、服务器与 ODM(9.4%)、GPU / AI 芯片(7.8%)。
括号内「占中国台湾」为该公司市值在该国 AI 算力公司合计市值中的占比; 「所处环节」链接到对应环节榜,可横向比较该国在各细分赛道的布局。